CPU High Thermal Conductivity Bonding Glue/CPU Thermal Adhesive

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US $28-38 / Grams | 300 Gram/Grams Thermal Conductivity Bonding Glue (Min. Order)
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Overview
Quick Details
Place of Origin:
Guangdong, China (Mainland)
Classification:
Double Components Adhesives
Main Raw Material:
Epoxy
Usage:
Packing,Bonding electronic components
Brand Name:
King Bali
Model Number:
King Bali-1900
Name:
Thermal Conductivity Bonding Glue
Density:
1.36~2.7
Breakdown voltge:
>10
Dielectric constant:
>4
Color:
Two Colors
Viscosity:
100-400 pa.s
Hardness:
≥80 Shore A
Thermal Impedance:
0.09 ℃-in2/W
SupplyAbility
SupplyAbility:
100 Gram/Grams per Day Thermal Conductivity Bonding Glue
Packaging & Delivery
Packaging Details
Barrel or Customized
Port
Yantian
Lead Time :
Within 3-5 Days

Specifications

Thermal Conductivity Bonding Glue
1.hot glue,high gel-point
2.matt,good stability
3.strong adhesive strength

  CPU High Thermal Conductivity Bonding Glue/CPU Thermal Adhesive      

 

King Bali 1900 Bonding Glue is fixed for bonding electronic components and packing, for metal, ceramics, glass, fiber products and rigid plastic encapsulation between bongding, with excellent adhesion strength of this series can be modulated as required curing time.

Properties:

Model1900A 1900B 
 Exterior UnitBrown White
Before the VulcanizationViscosity pa.s 300-400 100-200
Density g/cm3 2.7 1.36
Mix Ratio By Weight /  1:1
Completely Cure Time H  1-2.5
OT min  30
After the VulcanizationThermal Impedance °C-in2/W  0.09
Hardness Shore A  ≥80
Hot Sex Variable Temperature   >120°C
Tensi Le Strength kg/mm2  >200
   Electrical CharacteristicsVolume Resistivity Ω.cm  
Breakdown Voltage KV/mm  >10
Dielectric Constant 50Hz  >4

 

 

To avoid affecting the heat -conducting and adhesiveness, please make sure that the surface of the component is clean enough and theres no such as dirt, oil or salt on it. . Well mix A in the original container before using for precipitation might appear after long time storage.

 

 

Weigh A and B exactly according to the specified ratio and then mix them well color difference exist for A and B, please mix them till color difference disappears) . Please use the mixed products in 1-2 hour(s). Over-time using leads viscosity increase. A proper amount is suggested to avoid wasting. . Thicker than 0.15mm application of the products causes lower speed of curing, lower heat conductibility and waste. . The speed of curing might be affected by seasons and temperature. Low speed in winter is possible. Heating to accelerate uring is recommended.

 

 

OVERVIEW OF OUR FACTORY:

 

 

 

OUR SERVICE:

 

  • Your inquiry related to our product & price will be replied within 24hours.
  • Well-trained & experienced staff are to answer all your inquiries in English of course.
  • OEM & ODM projects are highly welcomed. We have strong R&D team here to help.
  • Your business relationship with us will be confidential to any third party.
  • Good after-sale service offered, please get back if you got question.

 

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